首页 封装选型 光电隔离器封装
封装型号 图像 描述
WSOP16
WSOP8
VSOP4 2.0x4.0x1.2 (1.27mm脚间距)QFN
DIP8(10.16) 9.78x6.5x3.4(2.54mm脚间距) 宽爬电距离
DIP6(10.16) 8.8x6.5x3.4(2.54mm脚间距) 宽爬电距离
DIP4(10.16) 4.7x6.5x3.4(2.54mm脚间距) 宽爬电距离
SOP16
SSOP16 10.3x4.4x2.0 (1.27mm脚间距)
SSOP8 5.2x4.4x2.0(1.27mm脚间距)
SSOP4 2.7x4.4x2.0(1.27mm脚间距)
SOP8 4.9x3.9x3.2(1.27mm脚间距); SSR 9.3x4.4x2.0 (2.54mm脚间距)
SOP6 6.8x4.5x3.2 (1.27mm脚间距); SSR 6.3x4.4x2.0 (2.54mm脚间距)
SOP5 4.4x4.4x2.3 (1.27mm脚间距)
SOP4 4.4x4.3x2.2 (2.54mm脚间距)
SMD16 19.8x6.5x3.5 (2.54mm脚位间距)
SMD8 9.78x6.5x3.4(2.54mm脚间距)
SMD7 9.78x6.5x3.4(2.54mm脚间距)
SMD6 8.8x6.5x3.4(2.54mm脚间距)
SMD5 8.8x6.5x3.4(2.54mm脚间距)
SMD4 4.7x6.5x3.4(2.54mm脚间距)
SDIP6 6.8x4.5x3.2 (1.27mm脚间距);
LSOP5 7.6x3.8x2.0 (1.27mm脚间距)
LSOP4 7.6x3.8x2.0 (2.54mm脚间距)
DIP16 19.8x6.5x3.5 (2.54mm脚位间距)
DIP5 8.8x6.5x3.4(2.54mm脚间距)
DIP7 9.78x6.5x3.4(2.54mm脚间距)
DIP8 9.78x6.5x3.4(2.54mm脚间距)
DIP4 4.7x6.5x3.4(2.54mm脚间距)
DIP6 8.8x6.5x3.4(2.54mm脚间距)
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